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Weicon Flex+Bond

Material AG000447S01 Category Tags , , ,

Weicon Flex+Bond

An elastic adhesive and sealant that is used in many different industrial assembly and repair applications.

This high quality product combines high adhesion and versatility with the ability to create a permanent, flexible joint.

Weicon Flex+Bond is part of the Weicon family of elastic adhesives and sealants that are used in many different industrial assembly and repair applications. These high quality products combine high adhesion and versatility with the ability to create a permanent, flexible joint.

Weicon Flex+Bond offers high adhesive strength and bond almost all materials, including:

  • Metal
  • Wood
  • Plastic
  • Glass
  • Ceramic

Available in White, Black, Grey and Transparent, this high quality adhesive has a paste-like consistency and cures in environments with temperatures between 5ºC and 40ºC. It is over-paintable using the “wet in wet” method and, once cured withstands temperatures between -40ºC and 90ºC whilst also tolerating joint movement up to 15% (maximum).

Weicon Flex+Bond is used to cover gaps up to 5mm deep and 25mm wide and exhibits a very high elongation (650%) before breaking (according to DIN 53504 test requirements). This easy to use elastic adhesive exhibits very low shrinkage (1%) and has a pasty viscosity that allows for accurate and precise application.

Available Sizes

Each colour of Weicon Flex+Bond listed above is available from AG in convenient 85ml tubes and 200ml press packs.

Processing

The surfaces to be bonded should be clean and dry. To ensure optimum wetting, the parts should be joined before the adhesive has formed a skin (which occurs after about 25 minutes with Flex+Bond).

Weicon Flex+Bond cures by reacting with the humidity in the surrounding atmosphere. At 50% relative humidity and 25ºC the cure speed is approximately 3mm in the first 24 hours (starting from the exposed edges and proceeding inwards).

Adhesive bonds of large surfaces or high layer thicknesses cure slower as the humidity has further to penetrate. Curing of these larger bonds can be accelerated by increasing the temperature and/or humidity of the environment used for bonding. Lower temperatures or lower humidity will slow the cure time.

Adhesive Finder Tool

Unsure if this adhesive is suitable for your application? Try Weicon’s handy Adhesive Finder tool!

Additional Information and Resources

TDS Icon
Weicon Flex+Bond MS Polymer TDS
SDS Icon
Weicon Flex+Bond MS Polymer – Squeeze Tubes SDS
Brand

Any Approvals for Water / Food

Dangerous Goods for Transport

Colour

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Max. Continuous Temp.

Hardness

Elongation